What if a scalable AESA started with one highly Integrated chip?

We're exploring how far RF integration can go, co-defining the answer with the people who know the platform requirements.

Reducing the complexity with integrated RF

AIMS-X Integration

Highly Integrated IC: Complete RF front-end integrated into a single traditional plastic-packaged microchip.
Minimal Interfaces: Internally optimized interconnects minimize losses and enhance performance.
Low SWaP Profile: Dramatic reduction in Size, Weight, and Power.
Low Integration Risk: Plug-and-play architecture ready for scalable platforms.

Design objectives

Superior RF Performance

Lower loss, higher efficiency, better linearity.

Faster Time to Deployment

Integrated building blocks reduce development time.

Lower System Cost

Fewer components, interfaces and supply chain complexity.

Reduced Risk

Proven processes and extensive real-world experience.

Mission Reliability

Designed and validated for demanding environments.

AESA building block is the product

AIMS-X cross-section: die integrated on customer PCB

Used as an array building block

We are testing how much of the RF chain can move into a scalable RFIC platform without losing the performance and real system needs.

RF-linked satellite, aircraft and ground station over a coastal city at dusk

Built with the operator Not in a vacuum

We know RFIC and semiconductor design. The right architecture should be pressure-tested against real platform requirements before it becomes a product.

We're looking for:

1
A technical conversation to pressure-test the architecture against a real requirement.
2
Introductions to funding routes across European defence, space or dual-use programmes.

Get in touch